Hole metallization and plating technology are widely used in PCB manufacturing procedure to solve the key problems of interlayer connection or conduction. In the process of acidic copper plating in PCB, special organic additives are added to obtain metal deposit layer with fine grain, uniform copper distribution on the board and preferable via filling ability. In this process, the coating design of insoluble titanium anode plays a role in ensuring the uniformity of current distribution and controlling the reasonable and effective additive consumption.