PCB OER Pulse Copper Plating
PCB OER Pulse Copper Plating
Applications & Processes

For vertical pulse copper plating, Magneto has developed a new-generation OER coating stack incorporating an innovative intermediate-layer concept. While maintaining excellent intrinsic performance, the new architecture further enhances the performance of insoluble anodes, offers full compatibility with leading commercial additive systems, and meets customer requirements for both copper-plating quality and anode performance.

Superiority
  • Exceptional copper thickness uniformity
  • Full Process Compatibility
  • Significant Cost Benefits
  • Exceptional Durability
Application Conditions
  • Source of Cu
    Oxygen-free copper
  • Electrolyte
    CuSO4·5H2O,H2SO4,Cl ,Additives
  • Temperature
    20°C - 60°C
  • Pulse frequency
    Normally 2 – 8ASD FWD pulse and 6 – 24ASD REV Pulse
  • Pulse time
    Adjusted by requirements
  • Anode type
    New-generation titanium anode with mixed precious metal (iridium) oxide coating dedicated for RPP
  • Anode lifetime
    Service life > 1 year; or ≥50,000 KAH for flash plating, ≥70,000 KAH for via filling
PCB OER Pulse Copper Plating PCB OER Pulse Copper Plating