PCB Horizontal Pulse Copper Plating
PCB Horizontal Pulse Copper Plating
Applications & Processes

Magneto’s specially developed RPP anodes for horizontal pulse plating can be used in both flash-plating and via-filling stages. Under high-current-density conditions, the coating maintains high catalytic activity, helping to improve current efficiency during the electroplating process.


Modified Selecta® MS-6 Ir MMO Coating


MS-6 is designed for PCB oxygen evolution pulse copper plating processes with copper oxide powder. With excellent corrosion resistance and strong resistance to cathodic polarization, it maintains stable performance under demanding pulse electrolysis conditions. MS-6 effectively reduces brightener consumption, significantly extends anode service life, and contributes to a lower total cost of ownership.

Superiority
  • Outstanding cost-effectiveness
  • High compatibility with plating additives
  • Reduced additive consumption
  • Excellent throwing power
  • Excellent service life
Application Conditions
  • Source of Cu
    CuO Powder
  • Electrolyte
    CuSO4·5H2O,H2SO4,CI,Additives
  • Temperature
    20°C-50°C
  • Pulse Frequency
    Normally 1 – 4ASD FWD pulse and 1 – 8ASD REV Pulse
  • Pulse Time
    Adjusted by Requirements
  • Anode Type
    New-generation titanium anode with mixed precious metal (iridium) oxide coating dedicated for RPP
  • Anode Lifetime
    > 1.5 years
PCB Horizontal Pulse Copper Plating PCB Horizontal Pulse Copper Plating