In modern electronic manufacturing, vertical electroplating copper wires are widely used in the production of printed circuit boards (PCBs) and advanced packaging, serving as a key process for achieving high-density interconnection and enhancing electrical conductivity. As a crucial component of the electroplating system, the anode not only affects the uniformity and stability of the coating but also directly influences production efficiency and cost. Below, we will vividly illustrate the operational mechanism of vertical electroplating copper wires through animations, covering aspects such as plating solution flow, power supply function, anode reaction, and cathode reaction, and mainly highlight the unique advantages of the MAGNETO anode.
In vertical copper electroplating lines, the electrolyte continuously circulates and flows, maintaining stability through filtration and temperature control systems. Besides copper ions, the solution also contains electroplating-specific additives to regulate the brightness, smoothness, and internal stress of the coating. A uniform flow field not only ensures that copper ions fully penetrate micro-holes and through-holes but also promotes the even distribution of additives throughout the plating bath, providing reliable mass transfer conditions for subsequent electrochemical reactions.
Electroplating is a process that converts electrical energy into chemical energy, thus requiring a stable power supply device. In industrial production, silicon rectifier power supplies are commonly used, with current ranges from hundreds of amperes to several thousand amperes and voltages adjusted between 0 and 15 volts depending on the working conditions. Once powered on, electrons flow from the power supply to the anode and then through the electrolyte to the PCB substrate. The current flow between the anode and cathode provides the driving force for the migration and deposition of copper ions.
During the electroplating process, the main reaction at the cathode is the reduction and deposition of metal ions, while the reaction at the anode is closely related to the type of anode used.
For soluble anodes, metal dissolution occurs at the anode, generating metal ions that enter the plating solution to replenish those consumed during electroplating. However, insoluble titanium anodes do not undergo metal dissolution during electroplating, thus maintaining the stability and cleanliness of the electrolyte composition. Their primary function is to act as an electron intermediary, releasing electrons through electrolytic reactions to maintain circuit closure. The most typical reaction is the oxygen evolution reaction (OER):
2H₂O → O₂ + 4H⁺ + 4e⁻
During this process, water molecules are electrolyzed to produce oxygen, protons, and electrons. The electrons are transported through the external circuit to the cathode, where they are used for the reduction and deposition of copper ions.
MAGNETO employs a unique low-consumption coating process, which offers the following advantages under normal electroplating conditions:
- Reduced additive consumption: While maintaining catalytic activity, MAGNETO anodes, through their optimized coating structure and electrocatalytic properties, can significantly reduce the additional consumption of electroplating additives.
- Extended anode lifespan: The coating has excellent electrochemical stability, ensuring that the anode remains active and stable over long-term operation.
- Enhanced process stability: The anode reaction is more controllable, and the chemical balance of the electrolyte is easier to maintain, which helps achieve a more uniform and dense coating quality.
At the cathode end, Cu²⁺ ions in the solution gain electrons and are reduced to metallic copper, uniformly depositing on the surface and walls of the holes. This process not only ensures the smoothness and density of the coating but also improves the plating ability of through-holes and micro-holes, providing reliable electrical conductivity for high-density interconnect PCBs.
Cu²⁺ + 2e⁻ → Cu
Through the coordinated action of the anode and cathode ends, a circuit board with a smooth surface and uniform coating is ultimately obtained. With the stable performance of the MAGNETO anode, the entire electroplating process becomes more controllable and efficient, helping customers achieve higher-quality products and better production benefits.
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