Lead frame plating is an important surface finishing process in the electronics manufacturing industry. Through high-speed continuous plating, a uniform and dense metallic coating—either a single-metal or multi-metal coating—is rapidly deposited onto the surface of lead frames, which are commonly made of copper or stainless steel. This process enhances the electrical conductivity, wear resistance, and corrosion resistance of the lead frames. In addition, the coating thickness can be precisely adjusted according to specific requirements, enabling the process to meet the performance requirements of different products.
